Tantalum nitride
| Names | |
|---|---|
| Other names
Tantalum mononitride | |
| Identifiers | |
3D model (JSmol) |
|
| ECHA InfoCard | 100.031.613 |
| EC Number |
|
PubChem CID |
|
CompTox Dashboard (EPA) |
|
| |
| |
| Properties | |
| TaN | |
| Molar mass | 194.955 g/mol |
| Appearance | black crystals |
| Density | 14.3 g/cm3 |
| Melting point | 3,090 °C (5,590 °F; 3,360 K) |
| insoluble | |
| Structure | |
| Hexagonal, hP6 | |
| P-62m, No. 189 | |
| Hazards | |
| Flash point | Non-flammable |
| Related compounds | |
Other cations |
Vanadium nitride Niobium nitride |
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
Infobox references | |
Tantalum nitride (TaN) is a chemical compound, a nitride of tantalum. There are multiple phases of compounds, stoichimetrically from Ta2N to Ta3N5, including TaN.
As a thin film TaN find use as a diffusion barrier and insulating layer between copper interconnects in the back end of line of computer chips. Tantalum nitrides are also used in thin film resistors.