RCA clean

The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing.

Werner Kern developed the basic procedure in 1965 while working for RCA, the Radio Corporation of America. It involves the following chemical processes performed in sequence:

  1. Removal of the organic contaminants (organic clean + particle clean)
  2. Removal of thin oxide layer (oxide strip, optional)
  3. Removal of ionic contamination (ionic clean)
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